电路切割是一种通过将大型量子电路分割为较小子电路进行仿真的技术，这些子电路可以在较小的量子设备上运行。然后通过经典的后处理步骤将这些子电路的结果组合起来，以准确重构原始电路的期望值。电路切割引入了随被切割门和量子比特线路数量呈指数增长的抽样开销。许多最近开发的准概率电路切割技术利用子电路内部中间测量得到的经典侧信息来增强后处理步骤。在本文中，我们通过量子仪器的形式化一般电路切割技术来利用侧信息。借助此框架，我们分析了经典侧信息在减少电路切割抽样开销方面的优势。令人惊讶的是，我们发现某些情况下，侧信息不会降低抽样开销，而在其他情况下，它对于电路切割的可行性至关重要。此外，我们提出了一个带有侧信息的最优抽样开销下界，可以通过半定规划高效评估，并优于所有先前已知的下界。

Circuit cutting is a technique for simulating large quantum circuits by partitioning them into smaller subcircuits, which can be executed on smaller quantum devices. The results from these subcircuits are then combined in classical post-processing to accurately reconstruct the expectation value of the original circuit. Circuit cutting introduces a sampling overhead that grows exponentially with the number of gates and qubit wires that are cut. Many recently developed quasiprobabilistic circuit cutting techniques leverage classical side information, obtained from intermediate measurements within the subcircuits, to enhance the post-processing step. In this work, we provide a formalization of general circuit cutting techniques utilizing side information through quantum instruments. With this framework, we analyze the advantage that classical side information provides in reducing the sampling overhead of circuit cutting. Surprisingly, we find that in certain scenarios, side information does not yield any reduction in sampling overhead, whereas in others it is essential for circuit cutting to be feasible at all. Furthermore, we present a lower bound for the optimal sampling overhead with side information that can be evaluated efficiently via semidefinite programming and improves on all previously known lower bounds.